Please join Angelina Lau, Senior Engineer at Micron Semiconductor Asia Operations, Singapore, and Dr Mustafa Kansiz from PSC, in this two-part webinar to learn how submicron IR (O-PTIR) spectroscopy, simultaneous Raman and co-located widefield fluorescence imaging is being applied for failure analysis and organic contamination identification of small, sub-surface and complex layers and particles in microelectronics and semiconductor components.
Traditional infrared techniques like FTIR and ATR microscopy face significant limitations when analyzing semiconductor defects—especially for recessed features, thin films, and damage-sensitive materials. These conventional methods struggle with spatial resolution, sample accessibility, and can cause thermal damage to delicate semiconductor structures.
Optical Photothermal Infrared Spectroscopy (O-PTIR) is revolutionizing semiconductor failure analysis.
This breakthrough technique enables ultra-low power, non-destructive analysis of semiconductor defects and contamination at the submicron scale, overcoming the accessibility limitations of FTIR-ATR and the thermal damage risks of traditional IR techniques. O-PTIR delivers simultaneous IR+Raman spectroscopy with co-located fluorescence imaging for comprehensive failure analysis in even the most challenging semiconductor samples.
Join us to discover how O-PTIR is transforming semiconductor quality control and failure analysis—finally making it possible to analyze the critical defects that impact device performance and reliability.
Webinar Highlights: ✅ Ultra-Low Power Analysis – Microwatt-level measurements without thermal damage to dark or colored semiconductor samples
✅ Accessing Recessed Defects – Analyzing features inaccessible with FTIR-ATR microscopy
✅ Enhanced Thin Film Sensitivity – Superior detection capabilities compared to conventional FTIR for critical semiconductor layers
✅ Simultaneous IR+Raman Analysis – Comprehensive spectral characterization with 2D simultaneous spectral library searching for confident identification
✅ Co-located Fluorescence Imaging – Improved optical contrast to guide precise measurement positioning
✅ Real-World Applications – Case studies demonstrating failure analysis and contamination identification in microelectronics
Who Should Attend? 🔬 Semiconductor Engineers – Failure analysis specialists, process engineers, and quality control professionals
🏭 Manufacturing & Process Control – Engineers focused on yield improvement and contamination control
🔍 Materials Analysis Labs – Analytical chemists and technicians specializing in semiconductor characterization
🧪 R&D Scientists – Researchers developing new semiconductor materials and device architectures
⚡ Electronics Industry Professionals – Experts in microelectronics, MEMS, and advanced packaging technologies
Don’t miss this opportunity to gain cutting-edge insights into semiconductor failure analysis!